• PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

Подробная информация о продукте:

Место происхождения: Китай
Фирменное наименование: MK
Номер модели: МКСП-С630Т

Оплата и доставка Условия:

Количество мин заказа: 50 шт.
Цена: negotiable
Упаковывая детали: Прочная фанера с подходящим мягким защитным материалом внутри, подходящая для дальних морских или во
Время доставки: 10-20 рабочих дней
Условия оплаты: LC, D/A, D/P, T/T, Western Union
Поставка способности: 10000 квадратных метров в месяц
Лучшая цена контакт

Подробная информация

Сырье: Высококачественная отечественная нержавеющая сталь SUS630T. Стандартная толщина: 10,0-2,0 мм
Макс. ширина: ≤ 1300 мм Максимальная длина: ≤2410 мм
Название продукта: Пресс-плита для ламинирования печатных плат и CCL SUS630T Шероховатость поверхности: Ра<0,15 мкм, Rz<1,5 мкм
Выделить:

SUS630T high-hardness lamination press plate

,

high-temperature resistant steel plate for PCB

,

corrosion resistant CCL production steel plate

Характер продукции

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
Feature Specification & Benefits
Raw Material High-quality domestic SUS630T stainless steel with mature, stable material formula
Cost Performance Reliable industrial-grade lamination quality with highly competitive pricing
Thermal Performance Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings
Material Performance High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability
Equipment Compatibility Universally compatible with all types of industrial lamination steel plate washing machines
Application Scenarios Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
Performance Parameter Mass-Lam Plate (SUS630T) Pin-Lam Plate (SUS630T)
Thickness 1.0-2.0mm 1.0-2.0mm
Max Width ≤1300mm ≤1300mm
Max Length ≤2410mm ≤2410mm
Thickness Tolerance ±0.10mm ±0.10mm
Surface Roughness Ra≤0.15μm, Rz≤1.5μm Ra≤0.15μm, Rz≤1.5μm
Positioning Hole Tolerance -- ±0.10mm
Standard Bushing Slot Tolerance -- 0 ~ +0.10mm
Warpage Degree ≤3mm/M ≤3mm/M
Length & Width Tolerance ±1mm ±1mm
Yield Strength ≥1175 N/mm² ≥1175 N/mm²
Tensile Strength ≥1400 N/mm² ≥1400 N/mm²
Extensibility ≥5% ≥5%
Hardness 50HRC±2 50HRC±2
Max Working Temperature ≤400℃ ≤400℃
Parallelism ≤0.03mm ≤0.03mm
Diagonal Deviation 1-2mm 1-2mm
Thermal Conductivity (@300℃) ≥18W/MK ≥18W/MK
Average Thermal Expansion Coefficient 10~12 (10⁻⁶/℃) 10~12 (10⁻⁶/℃)
PCB Lamination Steel Plate - High precision manufacturing process
SUS630T Lamination Press Plate for circuit board production

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